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Home / News / NEWS / Advanced Cartesian PCB Soldering Machine for Mobile Phone Assembly with Tin Feeding System

Advanced Cartesian PCB Soldering Machine for Mobile Phone Assembly with Tin Feeding System

Publish Time: 2025-11-19     Origin: BBA AUTOMATION

Advanced Cartesian PCB Soldering Machine for Mobile Phone Assembly with Tin Feeding System

In the fast-paced world of  mobile phone assembly, where PCBs are increasingly miniaturized and components densely packed, precision and efficiency are non-negotiable. The  advanced Cartesian PCB soldering machine with tin feeding system emerges as a tailored solution, combining rigid Cartesian motion, automated solder delivery, and mobile-focused design to meet the rigorous demands of soldering tiny, high-performance components in smartphone production.

Cartesian Motion: Rigid Precision for Miniaturized PCBs

The Cartesian structure is the machine’s core advantage, built on a stable X-Y-Z axis framework that delivers exceptional positional accuracy (±0.01mm). Unlike flexible robotic arms, the Cartesian design minimizes vibration and deflection, critical for soldering micro-components like 01005 resistors, fine-pitch ICs, and connector pins on mobile phone PCBs. Its rigid construction ensures consistent solder joint quality across thousands of cycles, eliminating defects like bridging or cold joints that plague less stable systems. The Cartesian motion also supports high-speed operation, with smooth, programmable paths that adapt to complex PCB layouts—from camera modules to charging port circuits—streamlining mobile phone assembly workflows.

Tin Feeding System: Automated Consistency for High-Volume Production

Integrated tin feeding system transforms the soldering process by delivering precise amounts of solder wire to the tip automatically. This eliminates manual tin handling, a major source of variability in mobile phone PCB soldering. The system adjusts feed speed and solder volume based on pre-set parameters, matching the needs of different components—from thin wires to larger ground pads. By ensuring uniform solder distribution, it reduces waste by up to 25% and cuts cycle times per PCB by 30%, making it ideal for mass mobile phone assembly. The system also supports lead-free solder options, complying with global electronics manufacturing standards and sustainability requirements.

Product Label Applicable to multiple sectors
robotic soldering machine Automotive Electronics

Tailored for Mobile Phone Assembly: Versatility and User-Friendliness

Engineered specifically for mobile phone assembly, this advanced machine balances technical performance with practical usability. It accommodates the small PCB sizes (typically 50x50mm to 200x200mm) common in smartphones, with a compact footprint that fits seamlessly into dense production lines. The user-friendly interface allows operators to store and recall hundreds of soldering programs, enabling quick changeovers between different phone models—essential in an industry with frequent product updates. Adjustable temperature control (180°C–480°C) protects heat-sensitive components like touchscreen controllers, while built-in anti-static protection prevents damage to delicate mobile electronics. Additionally, the machine’s low-maintenance design reduces downtime, ensuring uninterrupted production for time-sensitive mobile launches.

In summary, the fusion of  Cartesian precision,  tin feeding system automation, and mobile-focused engineering makes this  PCB soldering machine an indispensable tool for  mobile phone assembly. It delivers the speed, accuracy, and versatility needed to keep pace with the industry’s rapid innovation, helping manufacturers produce reliable, high-quality smartphones at scale.

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