Publish Time: 2025-12-26 Origin: BBA AUTOMATION
The hot iron soldering technology is the cornerstone of precision in mobile phone assembly. Mobile components are highly heat-sensitive—overheating can damage OLED screens, fingerprint sensors, or tiny circuit boards. The machine’s hot iron features rapid temperature rise (reaching 300°C in 2 seconds) and adjustable temperature range (200°C–450°C), allowing precise heat matching for different mobile components. Its fine-tipped iron heads (as small as 0.1mm) target tiny solder pads on mobile PCBs, avoiding solder bridges between adjacent pins—a common defect in manual soldering. The uniform heat distribution of the hot iron ensures firm solder joints, preventing issues like cold solder that could cause signal instability in mobile devices.
The integrated tin feeding system guarantees stable and controllable tin supply, which is essential for consistent mobile phone assembly quality. It supports tin wire diameters of 0.3–0.8mm, perfectly matching the tiny solder joints of mobile components. The automatic tin feeding mechanism delivers precise tin amounts (adjustable in 0.01g increments) per joint, eliminating defects caused by insufficient or excessive tin. Synchronized with the hot iron’s temperature and soldering time, the system ensures optimal solder flow and bonding. Compared to manual tin feeding, it reduces material waste by 35% and maintains uniform joint quality across high-volume mobile production lines.
| Product Name | Suitable for various industries |
| desktop soldering robot | LCD |
automatic soldering machine with Hot Iron Soldering and Tin Feeding System for Mobile Phone Assembly
Automatic Soldering Machine Cartesian Style with Five Axis Motion, Ideal for USB Connector Soldering